35 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array SP3003 lead-free/green series lead-free/green SP3003 description features applications the SP3003 has ultra low capacitance rail-to rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each i/o pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes at the maximum level speci?ed in the iec 61000-4-2 international standard ( level 4, 8kv contact discharge) without performance degradation. their very low loading capacitance also makes them ideal for protecting high speed signal pins such as hdmi, dvi, usb2.0, and ieee 1394. SP3003 lead-free/green series rohs pb green t - p x d b q b d j u b o d f p g 0.65pf (typ) per i/o t & 4 % q s p u f d u j p o p g ? l 7 contact discharge, ? l 7 b j s e j t d i b s h f
(iec61000-4-2) t & ' 5 q s p u f d u j p o
iec61000-4-4, 40a (5/50 ns) t - p x m f b l b h f d v s s f o u p g 0.5a (max) at 5v t 4 n b m m q b d l b h f t t b w f board space (sc70, sot553, sot563, msop10) t $ p n q v u f s 1 f s j q i f s b m t t . p c j m f 1 i p o f t t 1 % " t t % j h j u b m $ b n f s b t t / f u x p s l ) b s e x b s f 1 p s u t t 5 f t u & r v j q n f o u t . f e j d b m & r v j q n f o u pinout nc v cc i/o 1 gnd i/o 2 i/o 4 v cc i/o 3 i/o 1 gnd i/o 2 SP3003-04x/j SP3003-02x/j functional block diagram i/o2 i/o1 gnd i/o3 v cc i/o4 i/o1 gnd i/o2 v cc SP3003-04 SP3003-02 i/o 1 i/o 2 v nc gnd cc nc nc nc i/o 3 i/o 4 SP3003-04a
36 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array SP3003 lead-free/green series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not impli ed. absolute maximum ratings symbol parameter value units i p peak current (t p =8/20s) 2.5 a t op operating temperature -40 to 85 c t stor storage temperature -50 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 300 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units zener breakdown voltage v br i r =10a 6.0 v reverse leakage current i leak v r =5v 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 10.0 v i pp =2a, t p =8/20s, fwd 11.8 v esd withstand voltage 1 v esd iec61000-4-2 (contact) ? kv iec61000-4-2 (air) ? kv diode capacitance 1 c * 0 ( / % reverse bias=0v 0.80 pf reverse bias=1.65v 0.65 pf diode capacitance 1 c i/o-i/o reverse bias=0v 0.35 pf / p u f 1 b s b n f u f s j t h v b s b o u f f e c z e f w j d f d i b s b d u f s j [ b u j p o
37 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array SP3003 lead-free/green series lead-free/green SP3003 capacitance vs. bias voltage insertion loss (s21) i/o to gnd capacitance vs. frequency -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 1.e+06 1.e+07 1.e+08 1.e+09 1.e+10 frequency [hz] insertion loss [db] 0 2e-13 4e-13 6e-13 8e-13 1e-12 1.2e-12 1.4e-12 1.e+06 1.e+07 1.e+08 1.e+09 frequency [hz] capacitance [f] 1.00 0.95 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 i/o capacitance (pf) i/o dc bias (v) v cc = 3.3v v cc = float v cc = 5 v
38 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array SP3003 lead-free/green series re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5 c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 2 5 c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters application example clk+ gnd clk- d2+ gnd d2- d1+ gnd d1- d0+ gnd d0- hdmi or dvi connector hdmi or dvi interface ic d0+ d0- d1+ d1- d2+ d2- clk+ clk- 6 5 4 sp300x-04 1 2 3 +5v gnd 6 5 4 sp300x-04 1 2 3 hdmi or dvi application example for the littelfuse sp300x-04 protection devices. a single 4 channel sp300x-04 device can be used to protect four of the data lines in a hdmi/dvi interface. two (2) sp300x-04 devices provide protection for the main data lines. low voltage asic hdmi/dvi drivers can also be protected with the sp300x-04, the +v cc pins on the sp300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +v cc of the sp300x-04 can be n p b u f e p s / $
39 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array SP3003 lead-free/green series lead-free/green SP3003 package dimensions sc70-6 d a2 a a1 c l e he 2 1 3 6 5 4 e e b package sc70-6 pins 6 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 solder pad layout package dimensions sc70-5 d a2 a a1 c l e he 2 1 3 6 5 not used 4 e e b package sc70- 5 pins 5 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 solder pad layout package dimensions sot553 package sot 55 3 pins 5 millimeters inches min max min max a 0.50 0.60 0.020 0.024 b 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 d 1.50 1.70 0.059 0.067 e 1.10 1.30 0.043 0.051 e 0.50 bsc 0.020 bsc l 0.10 0.30 0.004 0.012 he 1.50 1.70 0.059 0.067 c he l a d 6 4 2 3 e e b 5 (not used) solder pad layout
4 0 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array SP3003 lead-free/green series product characteristics lead plating matte tin lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 / p u f t 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13. part numbering system part marking system sp 3003 -04 x t g silicon protection array series number of channels -02 = 2 channel (sc70-5, sot553 packages) -04 = 4 channel (sc70-6, sot563, msop-10 packages) package a = msop-10, 3000 quantity j = sc70-5 or sc70-6, 3000 quantity x = sot553 or sot563, 5000 quantity t= tape & reel g= green xxx x x x product series (varies) f, h or p = SP3003 series assembly site (varies) number of channels (varies) 2 or 4 package dimensions sot563 package sot 5 63 pins 6 millimeters inches min max min max a 0.50 0.60 0.020 0.024 b 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 d 1.50 1.70 0.059 0.067 e 1.10 1.30 0.043 0.051 e 0.50 bsc 0.020 bsc l 0.10 0.30 0.004 0.012 he 1.50 1.70 0.059 0.067 c he l a d 6 4 2 3 e e b 5 solder pad layout package dimensions msop10 package msop10 pins 10 millimeters inches min max min max a - 1.10 - 0.043 a1 0.00 0.15 0.000 0.006 b 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 d 2.90 3.10 0.114 0.122 e 4.67 5.10 0.184 0.200 e1 2.90 3.10 0.114 0.122 e 0.50 bsc 0.020 bsc he 0.40 0.80 0.016 0.032 solder pad layout
4 1 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array SP3003 lead-free/green series lead-free/green SP3003 embossed carrier tape & reel speci?cations - sot553 and sot563 millimetres inches min max min max e 1.65 1.85 0.064 0.072 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.076 0.080 d 1.40 1.60 0.055 0.062 d1 0.45 0.55 0.017 0.021 p0 3.90 4.10 0.153 0.161 10p0 40.0+/- 0.20 1.574+/-0.007 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 1.73 1.83 0.068 0.072 b0 1.73 1.83 0.068 0.072 k0 0.64 0.74 0.025 0.029 t 0.22 max 0.008 max ordering information part number package marking min. order qty. SP3003-02jtg sc70-5 f x 2 3000 SP3003-02xtg sot553 f x 2 5000 SP3003-04atg msop-10 f x 4 3000 SP3003-04jtg sc70-6 f x 4 3000 SP3003-04xtg sot563 f x 4 5000 embossed carrier tape & reel speci?cations - sc70-5 and sc70-6 millimetres inches min max min max e 1.65 1.85 0.064 0.072 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.076 0.080 d 1.40 1.60 0.055 0.062 d1 1.00 1.25 0.039 0.049 p0 3.90 4.10 0.153 0.161 10p0 40.0+/- 0.20 1.574+/-0.007 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 2.14 2.34 0.084 0.092 b0 2.24 2.44 0.088 0.960 k0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max
4 2 ?2008 littelfuse, inc. silicon protection arrays tm speci?cations are subject to change without notice. please refer to http://www.littelfuse.com for current information. low capacitance esd protection array SP3003 lead-free/green series embossed carrier tape & reel speci?cation - msop-10 millimetres inches min max min max e 1.65 1.85 0.064 0.072 f 5.40 5.60 0.212 0.220 d 1.50 1.60 0.059 0.062 d1 1.50 min 0.059 min p0 3.90 4.10 0.153 0.161 10p0 40.0+/- 0.20 1.574+/-0.007 w 11.90 12.10 0.468 0.476 p 7.90 8.10 0.311 0.318 a0 5.20 5.40 0.204 0.212 b0 3.20 3.40 0.125 0.133 k0 1.20 1.40 0.047 0.055 t 0.30 +/- 0.05 0.011+/- 0.001
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